How to use the 861X 1300W hot air rework station for ASIC miner repair?

861X 1300W rework station is a powerful hot air desoldering rework station, mainly used for the disassembly and soldring of BGA chips on Antminer Z15 series, E9, E9pro etc. hash board.

861X 1300W hot air rework station features:

1. 1300W high power design ensures sufficient heating capacity and fast temperature response, suitable for the disassembly and soldering needs of various BGA chips.

2. Temperature and air volume can be controlled independently, ensuring accuracy and stability during the disassembly and soldering process.

3. Large LCD display, you can directly observe the value of temperature and air volume.

4. Low power consumption and thin, easy to carry.

Product buttons and function introduction:

1. Temperature adjustment and air volume adjustment.

2. Three temperature lock channels, you can set three different working modes according to different working needs.

3. Magnetic switch, put the hot air gun on the handle bracket, and the desoldering station will quickly enter sleep mode.

4. The hot air gun adopts a brushless vortex fan design, which rotates to discharge air, with adjustable air flow and a large range, and can be adapted to a variety of uses.

5. It can be adapted to a variety of models of hot air gun nozzles.

Disassembly of BGA chips:

1. Place the hash board or control board on the workbench.

2. Install the hot air gun nozzle, set the temperature and air volume of the hot air gun. The nozzle model, the temperature, the air volume of the hot air gun should be adapted to the model of the BGA chip to be disassembled.

3. Place the BGA chip in the center of the nozzle. Hold the handle of the hot air gun and move the nozzle evenly over the BGA chip to heat it until the tin beads under the BGA chip are completely melted.

4. After the tin beads are completely melted, use tweezers to gently pick up the BGA chip and place it in a dust-free cloth or material box.

Soldering of BGA chip:

1. As above, place the hash board or control board on the workbench.

2. Use tweezers to gently pick up the BGA chip to be soldered and place it on the solder pad.

3. Make sure that the solder ball on the BGA chip completely overlaps with the solder point on the solder pad.

4. Use tweezers to press the BGA chip to fix it, and apply solder paste around the solder point.

5. Set the appropriate temperature and air volume for the hot air gun and install the nozzle.

6. Use the hot air gun to evenly heat the solder paste at the solder point. After the solder paste melts, completely fix the solder point and the solder ball of the BGA chip.

7. The disassembly and soldering of the BGA chip are completed.

Note:

1. During the entire soldering and desoldering process, it is crucial to maintain a clean operating environment to avoid contamination of the BGA 2. chip by dust, impurities, and other pollutants.

Ensure that the 861X 1300W hot air rework station has accurate temperature control to prevent the BGA chip, from being damaged due to excessive or insufficient heat.

The 861X 1300W hot air rework station can efficiently and precisely heat the BGA chips on the hash board or control board, enabling rapid soldering and desoldering. At the same time, its precise temperature control and simple operation method greatly improve the success rate and efficiency of rework.