Tutorial on using the A113D control board chip tinning tool

A113D control board chip tin tool, it can apply a layer of tin to the main control chip on the A113D control board for Antminer S19J and S19J Pro. This tinning layer can improve the soldering quality between the chip and solder pad, and reduce the failure caused by poor soldering.

Product Features:

Adopting anti-electric and high-temperature resistant composite materials, it has high durability and stability, can maintain stable performance and reduce the failure rate during long-term and high-intensity use.

During the tinning process, the quality of the coating can be ensured. The tin tool can make the chip produce a uniform, dense and bright coating, improving the performance of the chip.

Steps for using the A113D control board chip tin tool:

Preparation tools: A113D control board chip tin tool, solder paste, scraper, tweezers, hot air gun

Disassemble the A113D control board chip tin tool and divide it into two parts: the base and the steel mesh template.

Use tweezers to hold the chip to be tinned and place it face down on the base.

Replace the stencil template on top of the base, making sure that the chip's pins are aligned with the stencil holes.

Use a scraper to apply solder paste on the stencil template, and spread the solder paste evenly on the stencil. The solder paste is pressed by the scraper and penetrates from the steel mesh into the back of the chip and the pins of the chip.

After the application is completed, take out the chip, use the tweezers to hold the edge of the chip, and use a hot air gun to heat the pins to melt the solder paste.

The tin plating of the chip is completed.

With the help of the A113D control board chip tin tool, we can coat the chip with a tin layer. The tin plating layer can form a protective film on the surface of the chip, effectively blocking the corrosion of corrosive substances such as oxygen and water, thereby significantly improving the corrosion resistance of the chip. The tin plating layer can also slow down the aging rate of the chip, extend the service life of the chip, and improve the performance and stability of the chip by preventing oxidation, corrosion and corrosion.